-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Candor Nails the ROI With InduBond
June 7, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Nolan Johnson follows up on his original interview with Sunny Patel, engineering manager at Candor Industries, about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine.
Nolan Johnson: You recently installed the InduBond X-Press 360 lamination press. There’s a lot of hype and promise around this particular technology regarding energy savings and versatility. What are your impressions in using this press?
Sunny Patel: Well, the hype is real. It’s such a great machine. Because of its simplicity and the flexibility of use, I find it a lot easier to work with than our previous press. The energy savings speak for themselves; the capabilities of going up to 375°C and 65 kg/cm2 pressure allows us to do pretty much any kind of pressing. The name of the game right now is to try to increase your available capabilities; the press does that without many difficulties. You don’t need a PhD on the machine and it’s very easy to use. We’re very happy with it.
Johnson: That’s great to hear. Capabilities and energy use are two of the things that are significantly better. Is there a positive impact on throughput?
Patel: Yes. The system that we used before was a good system. But the nice thing about the InduBond is you can control both the heating and the cooling. Because everything is so dialed in, the time we used to take to wait for the cooling has dramatically decreased. There’s a lot of throughput increase as well, not only on that side, but also the layout process, because previously we had used a continuous copper foil lamination system. Other people may not have the same problem; they would have problems with pinning. Our headache may not have been pinning, but other board shops may find this a lot easier because it’s a pinless system.
You don’t have to move around bulky press plates. Just build your book, put in your stainless steel, and just keep stacking; it’s simple to do. I can do it and I never ran a press before this one. Overall, throughput has increased, just because of the capability. The smaller your press stack is, the faster you can heat up because there’s less load. You can even do the small quick-turns pretty fast.
Johnson: Have you had a chance to put together some numbers on how the operating costs have changed? For example, you said that the energy savings are dramatic. What are the numbers?
Patel: I don’t have the numbers in front of me, but I believe I calculated one press before to be $40 or $50 a lamination press cycle. Now it’s around $5. If you add up all the presses, it’s quite a significant savings. Not only that, but we’re using less copper. And because the layout is easier, we’re saving on time.
To read this entire conversation, which appeared in the May 2022 issue of PCB007 Magazine, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.