Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Machine Vision: MVTec Expands Deep Learning Portfolio with New Versions of its Deep Learning Tool

04/29/2025 | MVTec Software GmbH
The machine vision industry is gaining significant momentum by using deep learning, a subset of artificial intelligence, which allows for the automation of entirely new applications and improved results.

Airbus Built Forest Monitoring Satellite Biomass Successfully Launched

04/28/2025 | Airbus
The Airbus built forest monitoring satellite Biomass has been successfully launched into orbit. A European Space Agency (ESA) flagship mission, Biomass will use its revolutionary P-band synthetic aperture radar instrument to measure forest biomass to assess terrestrial carbon stocks and fluxes to enable scientists to better understand the carbon cycle and its effects on climate change.

Asia/Pacific AI Spending to Reach $175 Billion by 2028, Driven by GenAI Boom

04/25/2025 | IDC
According to the IDC Worldwide AI and Generative AI Spending Guide, the Asia/Pacific region, including China and Japan, is experiencing unprecedented growth in Artificial intelligence (AI) and generative AI (GenAI) investments, spanning software, services, and hardware designed for AI-driven systems.

It’s Only Common Sense: Selling to Engineers

04/28/2025 | Dan Beaulieu -- Column: It's Only Common Sense
Selling to engineers is an art and a science. It requires a tailored approach that respects their mindset and professional priorities, provides data, demonstrates expertise, and solves problems. Here’s how to master the art of selling to engineers.

Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

04/23/2025 | BUSINESS WIRE
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, bolsters its leadership in foundational AI silicon connectivity subsystems through silicon proven chiplets and IP subsystems on advanced process nodes and package types. This is set to be showcased at the TSMC 2025 North America Technology Symposium.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in