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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Segment 9 of Koh Young Webinar Series: Koh Young Auto Programming (KAP)
November 24, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch & Learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
At just over 8 minutes, the ninth episode, “AI in Action” is now available to view.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
In this segment, viewers will learn about 3D profilometry technology and how it converges with Koh Young’s proprietary AI technology to deliver true automatic programming. This geometry-based software solution reduces the programming process to minimize time to production and reduce costs.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit “Converting Process Data Into Intelligence” and start watching, free, today!
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Market Insights with Pluritec's Maurizio Bonati
04/23/2026 | Real Time with... APEX EXPONolan Johnson interviews Maurizio Bonati, VP of Sales at Pluritec, at APEX EXPO 2026. Bonati details Pluritec's three product divisions, covering a broad spectrum of PCB manufacturing. He discusses the current robust electronics market, driven by AI applications in Asia and technological investments in North America, while noting slower demand in Europe. The interview highlights key sectors like data centers, AI, and medical that benefit from advanced electronics.
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young AmericaKoh Young, the industry leader in True3D™ measurement-based inspection solutions, is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), May 26–29, at the JW Marriott & The Ritz-Carlton Grande Lakes in Orlando, Florida. The advanced packaging industry is demanding a level of inspection precision that traditional metrology simply cannot deliver, and Koh Young is ready to meet that moment.
Smart Automation: The Journey of a Component Through an SMT Factory
04/22/2026 | Josh Casper -- Column: Smart AutomationIn electronics manufacturing, the SMT line tends to get most of the attention. Placement machines, inspection systems, screen printers, and reflow ovens often take center stage when discussing productivity improvements or new equipment investments. While these systems are obviously critical to the manufacturing process, they only represent a portion of the journey every component takes before becoming part of a finished assembly.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Molex Accelerates Supply Chain Transformation with Celonis AI
04/17/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.