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New Cryostatic Systems Elevate Current Research on Qubits

03/31/2025 | Fraunhofer IAF
The Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting systems.

Real Time with... IPC APEX EXPO 2025: Schmoll America—Committed to Supporting Customers

03/31/2025 | Real Time with...IPC APEX EXPO
Kurt Palmer of Schmoll America and Stephan Kunz of Schmoll Maschinen GmbH had a great show, reporting solid attendance and good opportunities, as Schmoll America celebrates its first anniversary. With a booth full of equipment for attendees to see and touch, they showcased unique products like the Pico laser and X-ray machine, and discussed plans for a new facility.

HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology

03/27/2025 | PRNewswire
The consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.

Real Time with... IPC APEX EXPO 2025: Exploring Burkle's Innovations at IPC APEX EXPO 2025

03/27/2025 | Real Time with...IPC APEX EXPO
Burkle North America's Andy Turner shares insights from the show, highlighting the excitement surrounding the event and Burkle North America's growth potential. He invited attendees to their booth to interact with the InfoCube, a cutting-edge touchscreen showcasing Burkle's diverse product offerings.

Real Time with... IPC APEX EXPO 2025: Kyzen—Enhancing PCB Cleaning Processes

03/26/2025 | Real Time with...IPC APEX EXPO
Jayson Moy of KYZEN discusses recent changes the company has made that are aimed at adding value to the industry. He highlights the significance of a reliable cleaning process for PCBs, which can prevent issues and boost efficiency.
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