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Nordson Electronics Solutions Introduces MARCH MegaVIA Plasma Treatment System
June 30, 2021 | Nordson Electronics SolutionsEstimated reading time: 1 minute
Nordson Electronics Solutions, a division of Nordson Corporation, a global leader in plasma processing technology, introduces the MARCH MegaVIA™ Plasma Treatment System with a 15-cell configuration for panel sizes up to 30 x 52 inches in printed circuit board manufacturing. With overall dimensions of 1652mm W x 1782mm D x 2326mm H, the new MegaVIA™ system offers increased panel loading by more than 54% with only a 2% increase in footprint when compared to a MARCH MaxVIA™-Plus. The new platform delivers high process reproducibility and plasma treatment uniformity for PCB panels.
“Nordson has set the global standard for plasma treatment in the PCB market for more than 35 years with its industry-leading MARCH VIA platform,” explained Al Bousetta, director of marketing, MARCH Products. “The new MegaVIA™ plasma system builds on the success of earlier platforms with increased process capacity for large panels and minimum use of valuable production floor space. As with other VIA series products, the system provides uniform plasma treatment results to meet rigorous PCB manufacturing requirements.”
The MegaVIA™ system provides plasma treatment at 40 kHz and accommodates all common gases -- CF4, oxygen, nitrogen, and argon -- with high process reproducibility and uniformity. An EPC controller with intuitive Windows® 10 PC-based touch screen HMI allows for a wide range of data collection and control capabilities.
Plasma treatment uniformity is critical for a large chamber system. Higher than 80% uniformity for desmear and etch back applications to both sides of the PCB panels is achieved using the MegaVIA™ system’s power-power electrode configuration, balanced vacuum and gas flow, and temperature management technologies.
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American Made Advocacy: The Administration Changed, but Our Industry’s Needs Remain
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!