Elementary, Mr. Watson: The Design Matrix—Revealing the Hidden Truths of Reality
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Robotic Assistance Devices Large Opportunity on the Immediate Horizon
December 23, 2020 | Business WireEstimated reading time: 1 minute
Artificial Intelligence Technology Solutions, Inc. has announced that a major dealer of AITX’s wholly owned subsidiary Robotic Assistance Devices (RAD) has received a greatly anticipated order for a 5-unit RAD solution. This integrated autonomous remote security and access solution will be deployed to a Fortune 500 end-user client with over 10 distribution centers and over 7,500 retail locations in the U.S. and Puerto Rico.“The order of five units spans three different RAD devices acting as a complete system and saving the facility hundreds of thousands of dollars versus legacy human-based solutions. If you’ve ever heard us talk about RADTown, well, this is what RADTown Logistics looks like.”
“This order holds particular significance as it is an endorsement of RAD’s vision of a fully integrated facility using its autonomous security solutions,” said Steve Reinharz, President and CEO of RAD. “The order of five units spans three different RAD devices acting as a complete system and saving the facility hundreds of thousands of dollars versus legacy human-based solutions. If you’ve ever heard us talk about RADTown, well, this is what RADTown Logistics looks like.”
Details of the agreement were not disclosed, but the company confirmed that it was told that contracts would be received by the end of this year. Implementation will be Q1 2021. Reinharz added, “This opportunity has been in play nearly a year and a half and went through exhaustive legal and other agency review. We’re delighted that the PO is expected to be in RAD’s hands by year end.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Kymeta Joins Red Cat Initiative for Maritime Connectivity
05/15/2026 | Globe NewswireRed Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.