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KYZEN’s AQUANOX A4618 and AQUANOX A4727 Highlighted at SMTA Huntsville and Atlanta Expo & Tech Forums

04/08/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Huntsville Expo & Tech Forum, scheduled to take place Tuesday, April 22 at the Jackson Center in Huntsville, AL, and the SMTA Atlanta Expo & Tech Forum.

Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm

04/03/2025 | Real Time with...IPC APEX EXPO
Michael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.

BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges

04/02/2025 | BEST Inc.
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.

Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies

04/02/2025 | Real Time with...IPC APEX EXPO
Jonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.

Knocking Down the Bone Pile: Basics of Component Lead Tinning

04/02/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
The component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
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