-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueTraining New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Indium Corporation Announces Partnership with InnoJoin
January 7, 2020 | Indium CorporationEstimated reading time: 1 minute

Indium Corporation has formed a new sales partnership with InnoJoin GmbH to better serve its NanoFoil® customers in Europe.
Indium Corporation will continue to produce large un-plated sheets of NanoFoil®. InnoJoin, a laser welding company and long-time user of NanoFoil®, will plate, cut, and provide all NanoFoil® products to customers in Europe from their Bremen, Germany headquarters.
This change will ensure better service for European as well as Middle East, African and Russian customers, and facilitate the enhanced growth of the product line. All non-European sales of NanoFoil® will continue as normal.
NanoFoil® is a nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications. NanoFoil® is a predictable, controllable, and affordable material that is industry-accepted and proven to lower manufacturing costs while providing repeatable and reliable bonds and reactions. It has applications in many industries, including semiconductor, aerospace, automotive, biomedical, and defense markets. NanoFoil® is available in thicknesses of 40 and 60µm; nanofoils of 80 and 100µm are no longer available.
To learn more about NanoFoil® or to see it in action, visit www.indium.com/nanofoil.
InnoJoin is a specialist for laser and surface applications. In the field of wear and corrosion protection for the oil and gas industry, InnoJoin ranks among the leading companies in Europe. InnoJoin works exclusively with state-of-the-art laser systems and robots. Constant internal developments ensure that its technological lead in the field is maintained and expanded.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp
Suggested Items
Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations
02/21/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.
FTG Announces Full Year and Q4 2024
02/20/2025 | Firan Technology Group CorporationDuring 2024, the Corporation invested in existing sites and grew the business organically. FTG is strategically deploying its capital in ways that will drive increased shareholder returns for the future in both the near term and long term. Specifically, FTG accomplished many goals in 2024 that continue to improve the Corporation and position it for the future, including:
FTG Announces New Aerospace Facility in Hyderabad, India
02/12/2025 | Firan Technology GroupFiran Technology Group Corporation announced the establishment of a new aerospace operation in Hyderabad, India, set to start production by the end of 2025.
RTX’s Pratt & Whitney Establishes European Technology and Innovation Center in the Netherlands
01/27/2025 | RTXRTX’s Pratt & Whitney announced plans to establish a European Technology and Innovation Center (ETIC) dedicated to advancing technologies for enabling more energy efficient and sustainable aviation.
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.