Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

sureCore Now Licensing its CryoMem Range of IP for Quantum Computing

11/26/2024 | sureCore
sureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.

IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging

11/26/2024 | Yusaku Kono, IPC Japan Representative
In the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.

Subdued Electronics Industry Sentiment Continues in November

11/25/2024 | IPC
IPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report

NEOTech Significantly Improves Wire Bond Pull Test Process

11/25/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.

Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment

11/25/2024 | Real Time with... electronica
In this interview from electronica 2024, Pete Starkey speaks with Andrea Furnari, VP of Electronic Test Products Business Unit for SPEA. The discussion revolves around AI integration in test equipment, trends in substrate materials, and SPEA's focus on R&D.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in