-
-
News
News Highlights
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Words of Advice: What are Your Biggest Design Challenges?
March 11, 2019 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
In a recent survey, we asked the following question: What are your biggest design challenges? Here are just a few of the answers, edited slightly for clarity.
- Finding skilled designers to hire.
- Having customers follow component design specs.
- Translating the idea into an image.
- Due to miniaturization of automotive electronics, keeping the CAF under a guaranteed level and at acceptable price levels.
- Meeting Class 3 aerospace specifications.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Green Circuits to Discuss Space-Ready Electronics Manufacturing to Space Tech Expo USA
05/12/2026 | Green CircuitsGreen Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, will exhibit at Space Tech Expo USA 2026, taking place June 2–4 in Anaheim.
Fabrinet Announces Q3 Fiscal Year 2026 Financial Results
05/11/2026 | FabrinetFabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced its financial results for its third fiscal quarter ended March 27, 2026.
IMI Reports Q1 2026 Results, Delivering Higher Profitability and Stable YoY Revenue
05/11/2026 | IMIIntegrated Micro-Electronics, Inc. (IMI), a global electronics manufacturing services provider, announced financial results of the first quarter of 2026 highlighting improved profitability and margin expansion, underscoring the effectiveness of its ongoing transformation initiatives despite pockets of market softness in the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.