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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Estimated reading time: 1 minute
10 Fundamental Rules of High-Speed PCB Design, Pt. 1
Over the years, I have focused on high-speed design, signal and power integrity, and EMC design techniques in a plethora of published technical articles—all of which have key points to consider and present a tremendous amount of information to absorb. In my next few columns, I will elaborate on ten of the most important considerations to embrace to achieve successful high-speed PCB designs that perform reliably to expectations.
Figure 1 lists the 10 fundamental rules of high-speed PCB design that I deem the most important to follow, although they may change after months of deliberation, like what happened with the laws of thermodynamics. The first established thermodynamic principle, which eventually became the second law, was formulated by Sadi Carnot in 1824. By the late 1800s, three laws of thermodynamics were clearly defined. However, in the 1930s—long after these three laws were already widely accepted—Sir Ralph Fowler and E.A. Guggenheim felt that another law, which they saw as the foundation of earlier laws, should be incorporated. Hence, it was numbered the zeroth law. Thus, there is always room for one more at the top!
To read this entire column, which appeared in the September 2018 issue of Design007 Magazine, click here.
More Columns from Beyond Design
Beyond Design: ReRAM–The Industry's Next Game-ChangerBeyond Design: Demystifying Common‑Mode Radiation
Beyond Design: Managing Linear Workflow Bottlenecks
Beyond Design: Micro-ohm Power Delivery Network for AI-driven GPUs
Beyond Design: The Fundamental Structure of Spectral Integrity
Beyond Design: Slaying Signal Integrity Villains
Beyond Design: Effective Floor Planning Strategies
Beyond Design: Refining Design Constraints