Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
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Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
December Issue of SMT Magazine Available Now
December 4, 2017 | I-Connect007Estimated reading time: Less than a minute
The solder paste printing process accounts for almost 70% of PCB assembly defects. The December 2017 issue of SMT Magazine, which is available now, looks into the critical factors causing these challenges, and features strategies, tips and tricks, to help assemblers improve the yield and quality in the solder paste printing operation.
Read the December issue of SMT Magazine, now on the virtual newsstand, and available for delivery in your e-mailbox by subscribing here.
Be sure to download the PDF version for future reference.
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