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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Estimated reading time: 2 minutes
Beyond Design: Rock Steady Design
How do we ensure that our high-speed digital design performs to expectations, is stable given all possible diverse environments, and is reliable over the product’s projected life cycle? One word: Impedance!
For the perfect transfer of energy and to benefit from the highest possible bandwidth, the impedance of the driver must match the impedance of the transmission line and be constant along its entire length. Also, the power distribution network (PDN) must provide low AC impedance up to the maximum bandwidth and deliver an undisrupted, minimal return path for high-current switching devices. These two seemingly unrelated concepts are controlled by the PCB stackup configuration including material selection and should be analyzed concurrently.
For a sufficiently large number of electronics products, failures are distributed in time as shown in Figure 1. This curve is called “the bathtub curve” and displays the typical reliability of diverse products regardless of their functionality. One would expect a product to fail after some years of service, but preferably long after the product becomes obsolete. Premature failures are of particular concern and are typically the result of poor design practice or substandard manufacture. This column will focus on the design aspects.
In a previous column, Intro to Board-Level Simulation and the PCB Design Process, I mentioned that the cost of development is dramatically reduced if simulation is employed early in the design cycle. If changes are made late in the design process, then it takes more time, people, material and therefore money to complete the project. The advantage of simulation is that it identifies issues early in the design process and rectifies them before they become a major problem. Design changes that occur:
- In the conceptual stage cost nothing;
- During the design stage requires just a little extra time;
- During the test stage means that you have to regress one stage;
- During production, or worse still, in the field, can cost millions to fix and possibly damage the company’s reputation.
Reference designs are arguably the cause of many reliability issues. Many reference designs are developed by academics who are lacking the knowledge of DFM and reliability and have little appreciation for real-world industry expectations. And although their design may work on the test bench, it may not work in an adverse environment or with a variance of vendor components where the margins become borderline.
To read this entire article, which appeared in the October 2016 issue of The PCB Design Magazine, click here.
More Columns from Beyond Design
Beyond Design: ReRAM–The Industry's Next Game-ChangerBeyond Design: Demystifying Common‑Mode Radiation
Beyond Design: Managing Linear Workflow Bottlenecks
Beyond Design: Micro-ohm Power Delivery Network for AI-driven GPUs
Beyond Design: The Fundamental Structure of Spectral Integrity
Beyond Design: Slaying Signal Integrity Villains
Beyond Design: Effective Floor Planning Strategies
Beyond Design: Refining Design Constraints