The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
Estimated reading time: 9 minutes
Design of Experiments
Figure 2: An example of factorial design of experiments (DOE) in printed circuit manufacturing to minimize innerlayer shifting during lamination.
The second experiment, in Figure 3, uses optimizing photoresist exposure, developing and etching to provide the highest production yield. The variable and levels were a full factorial design of three variables at three levels (center point):
1. Exposure energy in mjoules: 70, 50 & 30
2. Developer speed in inches per minute: 45, 40 & 35
3. Etcher speed in inches per minute: 45, 40 & 35.
The variables were chosen with the center point being the current production process: 50 mjoules, 40 in/min developer and 40 in/min etcher. The highest yield was 95% using slower developer speed, lower exposure intensity, and the slower etcher. Analysis shows that the developer speed has the greatest effect on yield and interacts with etcher speed.
Figure 3: An example of factorial design of experiments (DOE) in printed circuit manufacturing to optimize yield in exposure, developing and etch.
Page 3 of 5
Share on:
More Columns from Happy’s Tech Talk
Happy’s Tech Talk #43: Engineering Statistics Training With Free SoftwareHappy’s Tech Talk #42: Applying Density Equations to UHDI Design
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Happy’s Tech Talk #39: PCBs Replace Motor Windings
Happy’s Tech Talk #38: Novel Metallization for UHDI
Happy’s Tech Talk #37: New Ultra HDI Materials
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly