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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Design of Experiments
Figure 2: An example of factorial design of experiments (DOE) in printed circuit manufacturing to minimize innerlayer shifting during lamination.
The second experiment, in Figure 3, uses optimizing photoresist exposure, developing and etching to provide the highest production yield. The variable and levels were a full factorial design of three variables at three levels (center point):
1. Exposure energy in mjoules: 70, 50 & 30
2. Developer speed in inches per minute: 45, 40 & 35
3. Etcher speed in inches per minute: 45, 40 & 35.
The variables were chosen with the center point being the current production process: 50 mjoules, 40 in/min developer and 40 in/min etcher. The highest yield was 95% using slower developer speed, lower exposure intensity, and the slower etcher. Analysis shows that the developer speed has the greatest effect on yield and interacts with etcher speed.
Figure 3: An example of factorial design of experiments (DOE) in printed circuit manufacturing to optimize yield in exposure, developing and etch.
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Happy’s Tech Talk #32: Three Simple Ways to Manage and Control Wet Processes
Happy’s Tech Talk #31: Novel Ultra HDI Architectures
Happy’s Tech Talk #30: The Analog Computer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
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