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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Estimated reading time: 9 minutes
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Design of Experiments
Figure 2: An example of factorial design of experiments (DOE) in printed circuit manufacturing to minimize innerlayer shifting during lamination.
The second experiment, in Figure 3, uses optimizing photoresist exposure, developing and etching to provide the highest production yield. The variable and levels were a full factorial design of three variables at three levels (center point):
1. Exposure energy in mjoules: 70, 50 & 30
2. Developer speed in inches per minute: 45, 40 & 35
3. Etcher speed in inches per minute: 45, 40 & 35.
The variables were chosen with the center point being the current production process: 50 mjoules, 40 in/min developer and 40 in/min etcher. The highest yield was 95% using slower developer speed, lower exposure intensity, and the slower etcher. Analysis shows that the developer speed has the greatest effect on yield and interacts with etcher speed.
Figure 3: An example of factorial design of experiments (DOE) in printed circuit manufacturing to optimize yield in exposure, developing and etch.
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More Columns from Happy’s Tech Talk
Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication StackupsHappy’s Tech Talk #46: Data Management for AI and Automation
Happy’s Tech Talk #45: Designing the Smart Factory
Happy’s Tech Talk #44: Memories of the ‘Mystery Systems of the East’
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids