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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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The Shaughnessy Report: DGCD Trains, Mentors New Grads
Few new graduates enter the field of PCB design, and those who do may not receive adequate training. But when EE Brian Campbell came to Dynamic Group Circuit Design right out of college, the company's internship program helped him adjust to the real world of electronics design. Listen to Brian and Business Development Manager JoAnn Vigil discuss the criteria for hiring new graduates, as well as what it's like for a first-year design engineer.
More Columns from The Shaughnessy Report
The Shaughnessy Report: Always With the Negative WavesThe Shaughnessy Report: Breaking Down the Language Barrier
The Shaughnessy Report: Back to the Future
The Shaughnessy Report: The Designer of Tomorrow
The Shaughnessy Report: A Stack of Advanced Packaging Info
The Shaughnessy Report: A Handy Look at Rules of Thumb
The Shaughnessy Report: Are You Partial to Partial HDI?
The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down