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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Micross Achieves Class K Qualification for Space-Grade Hybrid Microelectronics

10/16/2026 | PRNewswire
Micross Components, a leading provider of high-reliability microelectronics for aerospace, defense, and space, has achieved MIL-PRF-38534 Class K qualification from the Defense Logistics Agency (DLA) Land and Maritime for its Apopka, Florida, facility.

Applied Materials, Besi Expand Strategic Partnership

10/02/2026 | Applied Materials
Applied Materials, Inc. and BE Semiconductor Industries N.V. (Besi) announced an expansion of their longstanding strategic partnership, with Besi joining Applied's EPIC Center as an Innovation Partner.

MKS Atotech Highlights Everplate Cu 300 2TF for Advanced Packaging

09/28/2026 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, highlighted Everplate Cu 300 2TF from its Atotech brand.

NHanced Semiconductors & University of Florida to Present on Advanced Packaging for Photonics at the 2026 SMTAI Conference

08/24/2026 | NHanced Semiconductors
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors vice-president Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026

08/18/2026 | PRNewswire
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.
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