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FIT Hon Teng, a subsidiary of Foxconn Technology Group, kicked off its "FIT Tech Day 2026". Themed "Light at Scale: The Next Frontier in Data Center Interconnects", the event brought together global leaders in optical communications, AI , and semiconductor industries to explore the next generation of AI connectivity , from light sources, materials, photonics technology, network architecture to manufacturing and the industrial ecosystem .
This event also showcased the cross-industry integration capabilities of the Foxconn Group. Chairman Liu Yangwei of Foxconn Technology Group attended in person, while Chairman Zheng Hongmeng of Foxconn Industrial Internet served as the opening guest, unveiling the event from the perspective of the group and industry, and demonstrating the complete layout of the Foxconn Group from semiconductors, AI , cloud infrastructure to manufacturing capabilities.
" AI is redefining the computing architecture of data centers and simultaneously driving optical communications into a new stage of development. In the next decade, we will see not only faster light, but also how light can be deployed on a large scale in a more reliable and efficient way," said Lu Songqing, Chairman of FIT . "Through the integration of different businesses and technological capabilities within the Foxconn Group, we have the opportunity to push the innovation of optical communications from single components to more complete systems and large-scale applications."
The first half of the event began with four keynote speeches, exploring the next steps for optical communication in the AI era from different technical perspectives. Dr. Wupen Yuen from Lumentum discussed the interconnect requirements of AI system architectures in scale-up , scale-out , and scale-across , as well as the trend of optical technology moving towards the core of AI system architecture. Dr. Chuck Mattera reviewed the evolution of semiconductor, laser, fiber optic, computing, and manufacturing technologies, and looked ahead to the large-scale application of optical products, from Pluggable Optics , CPO , and Optical I/O to Photonic Fabrics . Mr. Yoshiaki Sato from NTT Innovative Devices focused on the vision of optoelectronic convergence and the achievements in practical application, and shared the detachable optical engine architecture based on sockets , co - developed with FIT . Mr. Ashkan Seyedi from ams OSRAM introduced Wide & Slow Optics and Micro Emitter technology, discussing how to balance low latency, efficiency, density, reliability, and mass production as optics moves closer to the computing core.
The second half of the event featured a panel discussion moderated by Dr. Liu Yicheng of FIT , who invited Dr. Hou Hong, CEO of Semtech , Dr. Huang Weiping, founder of Ligent , Mr. Ernest Muhigana of MACOM , and Guo Haozhong, director of the Semiconductor Research Center at Foxconn Research Institute. The discussion covered topics ranging from optical modules, CPO , and high-speed interconnects to the industrial ecosystem required for AI infrastructure, and further explored how optical communication technology innovation will move towards reliable and scalable large-scale deployment as AI continues to expand.
FIT Tech Day 2026 will be a platform for in-depth exchanges across the industry chain. We cordially invite partners from the global optical communications, AI , semiconductor, and data center industries to attend FIT Tech Day 2026 , where they can engage face-to-face with industry leaders from around the world and explore the next generation ushered in by Light at Scale .
