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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

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Flex Connections: Material Selection in Nickel vs. Copper Tabs

09/17/2026 | Zack Schaner -- Column: Flex Connections
Flexible printed circuits are being designed to do more than route signals. In many applications, the flex circuit must also provide robust electrical interfaces, mechanical reinforcement, and reliable transitions between the circuit and surrounding assemblies. One effective way to accomplish this is by integrating copper or nickel tabs directly into a flexible printed circuit.

GSME Joined TSMC OIP Value Chain Alliance in North America

09/16/2026 | PRNewswire
GS Microelectronics U.S., Inc. (GSME), a leading semiconductor solutions provider, announced it has officially joined TSMC's Open Innovation Platform® (OIP) Value Chain Alliance (VCA) as a member partner in North America.

September I-Connect007 Magazine Pairs PCB Automation With Human Expertise

09/16/2026 | I-Connect007 Editorial Team
The September issue of I-Connect007 Magazine examines why employee experience and judgment remain essential as manufacturers bring more automation onto the shop floor. Industry experts share how companies can combine these strengths to improve processes without losing the knowledge behind them. Plus: We cover what's going in with the European PCB Design community.

Designing for a More ‘Intelligent’ and Connected Future

09/15/2026 | Marcy LaRont, I-Connect007 Magazine
With more collaborative and computationally demanding PCB designs, cloud-based workflows are rapidly moving from possibility to reality. But greater connectivity also raises new questions about data security, intellectual property, and the sharing of design information in an increasingly complex electronics ecosystem. In this interview, Kristin Moyer of the Global Electronics Association explores the benefits and challenges of cloud-based design environments, the growing importance of standardized data transfer protocols such as IPC-1751 and IPC-2581, and why a secure, intelligent data ecosystem will be essential for the future of co-design, automation, and advanced electronics manufacturing.

Below the Surface: What Engineers Find Challenging About High Frequency Signal Integrity

09/17/2026 | Chandra Gupta -- Column: Below the Surface
How do materials affect RF signal performance? It’s a fair question, and most will assume they already understand the answer. But this misunderstanding is exactly why so many high frequency designs underperform, require rework, or worse, fail in the field. Below the surface, where signal integrity is either preserved or destroyed, the truth is that at high frequencies, material selection matters, and that’s where most engineers get it wrong.
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