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Advanced Packaging at the Limits: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

09/15/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest looks at what happens as advanced packaging pushes further into the limits of scale, power, thermal performance, and manufacturing capability. These features examine the measurement technologies, materials decisions, manufacturing investments, and system-level challenges shaping the next generation of advanced electronics.

Marcy’s Musings: A World of Difference

09/17/2026 | Marcy LaRont -- Column: Marcy's Musings
I've spent a good deal of time in Asia over the years, both traveling and living there, so arriving in Thailand for THECA wasn't my first experience stepping into another culture or another way of doing business. Still, there is something about being there—moving through a different city, sitting down with people, listening to their conversations, and watching how they approach familiar challenges—that gets me thinking.

September SMT007 Magazine Examines Mexico’s Manufacturing Growth

09/01/2026 | I-Connect007 Editorial Team
Mexico is playing an increasingly important role in North American electronics manufacturing as companies invest in new capacity, reconsider sourcing strategies, and implement nearshoring plans. The September 2026 issue of SMT007 Magazine examines what’s behind this investment and what it means for the broader electronics supply chain. Through perspectives from companies operating and investing in Mexico, we explore trade considerations, manufacturing capabilities, and the opportunities and challenges of building a stronger regional supply chain.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

I-Connect007 Welcomes New Columnists from Flexible Circuit Technologies

08/12/2026 | I-Connect007
In an exciting new column for I-Connect007 Magazine, a team of application engineers from Flexible Circuit Technologies will draw on decades of experience designing and manufacturing flex and rigid-flex circuits to offer practical guidance to help PCB designers make better engineering decisions. Mark Finstad, Chris Clark, Terrill Schmidt, Dan Skweres, and Zack Schaner will rotate authoring the new column, called Flex Connections, which begins in the August issue, with Dan drawing on his many years of experience to explain why just because you can do something in PCB design, doesn’t mean you should.
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