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Advanced Electronics Packaging Digest

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IBIDEN Raises FY2026 Outlook on Strong AI Semiconductor Demand

08/05/2026 | IBIDEN
IBIDEN reported strong first-quarter fiscal 2026 performance, driven by robust demand for GPUs, high-end CPUs, and AI-related semiconductor package substrates.

Gartner Forecasts Worldwide IT Spending to Grow 14.2% in 2026, Totaling $6.37 Trillion

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Worldwide IT spending is expected to reach $6.37 trillion in 2026, up 14.2% from 2025, according to the latest forecast by Gartner, Inc., a business and technology insights company.

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An Active, Growing PCB Industry Tilts Toward High-Complexity Leaders

05/21/2026 | Mike Carano and Thiago Guimaraes, Global Electronics Association
Recent PCB market conditions point to an industry that is active and still expanding in important segments. Demand tied to AI infrastructure, servers, high-layer-count multilayer boards, HDI, ADAS, and defense-related programs remains an important driver of the market. These segments are helping sustain momentum even as conditions in other areas remain more mixed. The result is not a uniformly rising market, but one in which enough high-value activity is flowing through to keep much of the industry on a solid footing.

Gregoire Outters Promoted to President of Teledyne Marine Group

04/06/2026 | Teledyne
Teledyne Technologies Incorporated announced the promotion of Gregoire Outters to President of its Teledyne Marine Group.
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