Bob Neves, CEO of Reliability Assessment Solutions Inc., examines how electronics companies can approach product reliability more realistically. Drawing on concepts from his book, The Printed Circuit Assembler’s Guide to... ™ Via Structures: Reflow Process Survivability, Reliability, and Robustness, he describes the three Rs of via testing and reliability and stresses the importance of truly understanding the type of testing required in each specific use case. He warns that poorly aligned accelerated testing can lead to inaccurate life predictions, unnecessary over-engineering, and higher costs.
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