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Advanced Electronics Packaging Digest

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DoW Signs 7-Year Deals to Triple PAC-3 and Quadruple THAAD Production

08/31/2026 | U.S. Department of War
The Department of War (DoW) announced the signing of two pivotal framework agreements with General Dynamics Ordnance and Tactical Systems (GD-OTS) and Lockheed Martin.

Knocking Down the Bone Pile: Hot Air vs. Infrared PCB Rework

08/31/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Component rework is the controlled process of removing, replacing, repositioning, or repairing electronic components on an assembled PCB. Rework may be required because of component defects, incorrect placement, soldering defects, engineering changes, or damage identified during inspection or testing. A successful rework process uses controlled heating, soldering, cleaning, handling, and inspection techniques to restore the assembly while minimizing thermal and mechanical stress to the PCB and surrounding components.

Flexible Thinking: Beyond DFM—PCB Design and Manufacturing as a Cooperative Effort

09/01/2026 | Joe Fjelstad -- Column: Flexible Thinking
The concept of co-designing PCBs by incorporating input from all areas of manufacturing has grown significantly over the past several years, bringing a sharper focus on the early contributors to a collaborative electronic system. From those pioneers, we have learned that the PCB is no longer simply the platform on which a design is manifested; it is now an active part of the electrical, thermal, mechanical, and economic architecture of the product. As operating frequencies rise, component pitches shrink, power densities increase, and product schedules tighten, decisions made by one discipline can no longer be isolated from the consequences they create for others.

3 Key Takeaways From a New White Paper on Component Salvage

08/25/2026 | I-Connect007
Electronic waste is typically discussed in terms of recycling, but recycling is only one way to recover value from discarded electronics. In the white paper “Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste, and Ensuring Economic Reuse,” Nash Bell, president of BEST Inc., examines a different approach: harvesting high-value components from obsolete or superseded PCBs, reconditioning them, and putting them back into service.

HIROSE Electric Americas President Mark Kojak Named to ECIA Manufacturer Council

08/20/2026 | HIROSE Electric Americas
HIROSE Electric Americas is pleased to announce that Mark Kojak, President of HIROSE Electric Americas, has been named to the Electronic Components Industry Association’s (ECIA) Manufacturer Council.
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