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Molex Launches MiniMix Connectors for Humanoid Robotics

08/06/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems.

Intel, Google Cloud Announce Collaboration to Accelerate Intel’s AI-Enabled Enterprise Transformation

07/21/2026 | Intel Corporation
Intel and Google Cloud announced an expansion of their previously announced multi-year strategic collaboration, which would accelerate Intel’s enterprise-wide digital evolution through the deployment of Gemini Enterprise and Google Cloud.

Wistron Launches Taiwan’s First Improved Forest Management Carbon Sink Project

07/06/2026 | Wistron
Wistron Corporation announced that its forest carbon sink project, developed in collaboration with Yongzai Forestry Co., Ltd., has been approved by the Ministry of Environment under Taiwan’s Carbon Offset Voluntary Reduction Program.

John Andresakis Discusses Integrated Thin-film Resistive Foil Technology

04/10/2026 | Real Time with... APEX EXPO
John Andresakis of Ohmega Ticer shares his advanced solution that offers miniaturization, enhanced electrical performance, and stable resistance for next-generation PCBs. The high-demand applications for high-frequency phased-array antennas in commercial space and military sectors is driving the need for superior RF performance and simplified beam forming.

Dongguk University Develops Breakthrough Material for Next-Gen Smart Devices

03/13/2026 | PRNewswire
Next-generation optoelectronic systems (devices that convert light to electrical energy) leverage organic semiconductor-based indoor energy-autonomous architectures for cutting-edge applications.
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