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Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C. Designed to support increasingly demanding thermal environments, the new solution strengthens Qnity's portfolio of Kalrez® sealing technologies for semiconductor manufacturing. Kalrez® 7080 parts and other Kalrez® sealing solutions will be featured at Qnity’s booth at SEMICON West, Oct. 13-15, in San Francisco, Calif.
“Qnity's breadth of knowledge across semiconductor manufacturing gives us a unique perspective on the challenges our customers face throughout the fab, from process performance to equipment reliability,” said Kate Dei Cas, President, Semiconductor Technologies at Qnity. “Kalrez® sealing solutions are a powerful example of how we translate that deep understanding into innovations that directly improve yield, enhance reliability, and address increasingly demanding manufacturing requirements.”
Introducing Kalrez® 7080 parts: High-purity sealing performance beyond 300°C
Debuting at SEMICON West, Kalrez® 7080 parts are designed to address the growing demands of advanced thermal semiconductor processes. Engineered for applications operating at temperatures up to 330°C, the new perfluoroelastomer sealing solution combines thermal resistance with ultra-low outgassing and extremely low metallic contamination.
In internal thermal-aging evaluations conducted over four weeks (672 hours) of air exposure at temperatures up to 325°C, Kalrez® 7080 parts demonstrated exceptional thermal stability, extending the high-temperature capabilities of the Kalrez® sealing portfolio. This performance helps semiconductor manufacturers maintain sealing integrity in extreme-temperature environments, supporting process consistency, equipment reliability, and yield improvement.
Kalrez® 7080 parts are well suited for critical semiconductor applications, including diffusion, oxidation, thermal atomic layer deposition (ALD), metal chemical vapor deposition (CVD), and low-pressure chemical vapor deposition (LPCVD), helping customers improve process stability, enhance wafer yield, and reduce unplanned maintenance.
A comprehensive portfolio for semiconductor process challenges
At SEMICON West, Qnity will also highlight additional Kalrez® sealing technologies designed to support semiconductor manufacturing across a range of demanding operating environments:
Kalrez® 9400 parts are engineered for advanced plasma processing environments, delivering excellent plasma resistance, low particle generation, and reliable sealing performance for demanding etch and strip applications. First introduced at SEMICON West 2025, Kalrez® 9400 parts were recognized as one of three finalists for the Best of West Award from SEMI and Semiconductor Digest.
Kalrez® PF3 components combine Kalrez® perfluoroelastomer materials with precision-engineered metal hardware to simplify installation and improve sealing consistency. Designed to accommodate thermal expansion and demanding thermal cycling conditions, they support reliable performance in semiconductor and plasma processing applications.
Kalrez® UPHT grade parts are composed of an ultra-pure, high-temperature FFKM sealing compound developed for advanced semiconductor plasma processes. Offering ultra-low outgassing, low particle generation, and excellent plasma durability, they help manufacturers reduce contamination risks and support higher wafer yields.
Technologies for next-generation semiconductor manufacturing at SEMICON West
At SEMICON West, Qnity will showcase how advances in materials, process technologies, and critical equipment components can help manufacturers achieve reliable, high-yield production for next-generation semiconductor devices and advanced packaging architectures. In addition to its Kalrez® portfolio, Qnity will highlight a range of solutions supporting advanced node semiconductor fabrication, advanced packaging, and thermal management.
