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Advanced Electronics Packaging Digest

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Suggested Items

IBIDEN Raises FY2026 Outlook on Strong AI Semiconductor Demand

08/05/2026 | IBIDEN
IBIDEN reported strong first-quarter fiscal 2026 performance, driven by robust demand for GPUs, high-end CPUs, and AI-related semiconductor package substrates.

Removing the Bottleneck: ZOT's Transition to Direct Imaging

08/05/2026 | Marcy LaRont, I-Connect007
For many PCB fabricators, solder mask imaging can become one of the biggest constraints on production. Traditional exposure methods often involve lengthy setup times, multiple process steps, and opportunities for registration errors, leading to costly rework. ZOT Engineering Ltd., a UK-based contract electronics manufacturer specializing in PCB fabrication and assembly, recently modernized this part of its process by partnering with Schmoll Maschinen to deploy a maskless direct imaging (MDI) system.

Lockheed Martin Awarded $58.6B Multiyear PAC-3 MSE Contract

08/04/2026 | Lockheed Martin
The U.S. government awarded Lockheed Martin a seven-year undefinitized contract action (UCA) modification for up to $53.86 billion for PAC-3 Missile Segment Enhancement (MSE) interceptors, supporting the Department of War's Acquisition Transformation Strategy.

ESCATEC Expands Advanced SMT Capabilities in the UK

08/03/2026 | ESCATEC
ESCATEC has strengthened its surface-mount technology (SMT) capabilities in the UK with the addition of two new ASMPT SX pick-and-place modules at ESCATEC Mechatronics Ltd (EUK) in Lutterworth.

Connect the Dots: Total Value Manufacturing Solutions

07/30/2026 | Matt Stevenson -- Column: Connect the Dots
In my last column, I discussed total value management, an approach to the quality-versus-cost balancing act that integrates components of total quality management (TQM) and Lean manufacturing. Like those other methodologies, total value management prizes customer focus, continuous improvement, and employee empowerment.
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