Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

SMTC Named Frost & Sullivan’s 2026 North America Company of the Year

11/02/2026 | PRNewswire
As original equipment manufacturers (OEM) place greater emphasis on supply chain resilience, regionalized production, and faster response to changing market conditions, the role of electronic manufacturing services (EMS) providers is evolving.

Panasonic to Invest ¥92B in AI-related Business Expansion

11/02/2026 | Panasonic Industry Co., Ltd.
Panasonic Industry Co., Ltd. is actively investing in AI-related businesses to support the growing demand in the generative AI market.

Foxconn Industrializes Intelligence and Scales the Future With AI Factories

10/30/2026 | Foxconn
Foxconn is building an AI factory that turns industrial data into intelligence to power a self-learning manufacturing ecosystem.

Murata to Expand Production Capacity of Multilayer Ceramic Capacitors Going Forward

10/30/2026 | Murata
Murata Manufacturing Co., Ltd. (Murata) will expand its global production capacity of multilayer ceramic capacitors (MLCCs) by 2030 to meet medium- to long-term demand growth.

Infineon to Build Europe’s First 300mm GaN Power Semiconductor Fab

10/27/2026 | Infineon
Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in