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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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NVIDIA’s AI Rack Transition Accelerates; NVL72 Output Value to Exceed $710 Billion in 2027

08/28/2026 | TrendForce
TrendForce’s recent AI server industry report reveals that GB300 rack-scale solutions are set to be NVIDIA’s leading driver of shipments in 2026, with demand anticipated to remain robust through the first half of 2027.

IBM, Together AI Partner to Scale Open-Source AI Inference on IBM Cloud

08/14/2026 | IBM
IBM announced a collaboration with Together AI to deliver IBM and NVIDIA AI infrastructure. Under a multi-year $240M agreement between IBM and Together AI, IBM is positioned to deploy a large cluster of NVIDIA HGX B300 systems on IBM Cloud with expected availability in Q1 2027.

NVIDIA Partners With Major Firms to Mobilize $500B for AI Infrastructure

08/13/2026 | NVIDIA
NVIDIA announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time.

DRAM Supply to Remain Tight in 2027, Prompting NVIDIA to Lower HBM Configurations for Rubin Ultra

08/05/2026 | TrendForce
According to TrendForce's latest memory industry research, DRAM supply will remain tight through 2027, and uncertainty persists over memory suppliers' HBM4e validation timelines.

Amkor, NVIDIA Partner to Expand AI Packaging and Test

07/29/2026 | BUSINESS WIRE
Amkor Technology, Inc. announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms.
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