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MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech, offering process chemicals, equipment, software, and services, and ESI, offering laser systems, will showcase their latest innovations for electronics manufacturing at electronica India 2026, taking place September 16–18 at the Bangalore International Exhibition Centre (BIEC) in Bengaluru, India.
Visitors can meet MKS experts at booth H3.D32 and explore technologies spanning PCB manufacturing, advanced packaging, precision laser processing, optics, motion control, and smart manufacturing technologies. The portfolio supports manufacturing requirements associated with artificial intelligence (AI), high-performance computing (HPC), automotive electronics, and next-generation semiconductor applications.
As India expands its electronics manufacturing capabilities, manufacturers require technologies that support higher performance, process reliability and efficient scale-up. MKS addresses these requirements through a unique combination of process chemistry, equipment, software, laser technologies, photonics, and application expertise that enables innovation across the entire electronics manufacturing value chain.
The portfolio reflects MKS’ Optimize the Interconnect℠ approach, bringing together advanced plating technologies, laser processing solutions, optics, motion control, and Industry 4.0 software. By connecting capabilities across the manufacturing flow, MKS helps customers improve yields, increase throughput, and accelerate the production of increasingly complex electronic devices.
At electronica India 2026, MKS will highlight technologies for HDI PCB and package substrate manufacturing, advanced semiconductor packaging, flexible circuits and precision materials processing. These capabilities support applications including AI infrastructure, data centers, automotive electronics, electric vehicles and power electronics.
A wide range of advanced process and equipment solutions will be highlighted, including:
Atotech process chemistry
- ViaKing®: Enhanced graphite-based direct metallization process offering high reliability, low cost of ownership, and excellent stability for both high and low volume production
- Cupracid® AC 5: Conformal copper-plating process using soluble anodes and providing improved throwing power in through holes and blind microvias at high current densities for high-volume production.
- OS Tech® SIT: Single-step organic solderability preservative process providing stable coating performance for multiple reflow cycles and compatibility with mixed surface-finish production.
- CupraEtch® SR 8000: Cost-effective, cupric chloride-based microetching pretreatment providing uniform copper-surface roughening to support reliable photoresist and solder-mask adhesion.
- Spherolyte®: Electrochemical plating solutions for redistribution layers, copper pillars, diffusion barriers and solder-joint formation in advanced semiconductor packaging.
- Sulphamate HS: High-speed nickel plating delivering ultra-low stress, highly ductile deposits and exceptional productivity across Reel-to-Reel, Rack, and Barrel applications
Equipment solutions include:
- Uniplate Cu6®: Horizontal plating equipment for high-volume copper processing in advanced PCB manufacturing.
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- 5335™ flex PCB laser drill: Best-in-class high-volume FPC laser drilling machine for flexible PCB manufacturing
- Geode™ platform solutions: Next-generation PCB and advanced substrate CO2 and UV laser via drills
