Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Vision Marine Technologies Files U.S. Patent Application for Dual-Mode Electric Outboard Trim Control

07/02/2026 | PRNewswire
Vision Marine Technologies Inc., a marine technology and recreational boating company combining proprietary high-voltage electric propulsion technology with direct consumer market access through its Nautical Ventures retail, service and marina platform, announced the filing of a new U.S. patent application relating to dual-mode trim-control technology for electric outboard propulsion systems.

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.

Elementary, Mr. Watson: Builders of the Dream

07/02/2026 | John Watson -- Column: Elementary, Mr. Watson
In 1849, French writer, journalist, and satirist Jean-Baptiste Alphonse Karr wrote the famous line, “Plus ça change, plus c’est la même chose,” which translates as “The more things change, the more they stay the same.” He penned it in his satirical journal, Les Guêpes (The Wasps), during a period of great upheaval in France.

TTM Technologies to Join the Russell 1000 Index

06/26/2026 | TTM Technologies
The inclusion will become effective after the market close on June 26, 2026.

Taiwan Q1 2026 PCB Output Hits Record NT$245.6 Billion on AI Server Demand

06/23/2026 | TPCA
The Taiwan Printed Circuit Association (TPCA) and the Industrial Technology & Information Technology Institute (ISTI) released their latest Q1 2026 Taiwan PCB production and sales survey report, indicating that thanks to continued strong demand for AI servers, shipments of high-end PCB products such as substrates, high-layer-count boards (HLC), and HDI have grown. I
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in