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Advanced Electronics Packaging Digest

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Apple to Increase Spend with Broadcom to Produce Billions More U.S. Chips

07/09/2026 | Apple
Apple announced a new multiyear commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies for a wide range of Apple products.

ITT Completes Acquisition of Aerospace Contacts LLC

07/08/2026 | BUSINESS WIRE
ITT Inc. today announced the completion of its acquisition of the privately held Aerospace Contacts LLC (Aerospace Contacts), a recognized manufacturer of critical, high-reliability precision contacts, for a purchase price of $31 million.

Global Semiconductor Sales Increase 9.2% On-Month in May

07/07/2026 | SIA
The Semiconductor Industry Association (SIA) announced global semiconductor sales were $120.6 billion during the month of May 2026, an increase of 9.2% compared to the April 2026 total of $110.5 billion and 104.1% more than the May 2025 total of $59.1 billion.

Koh Young America Promotes Heriberto Cuevas to Country Manager of Mexico and South America Operations

07/07/2026 | Koh Young
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, proudly announces the promotion of Heriberto Cuevas to Country Manager for its Mexico and South America operations.

Teledyne's Emerald 67M Space Camera Enabled by SDL License

07/06/2026 | BUSINESS WIRE
Teledyne Digital Imaging US, Inc., a Teledyne Technologies company, announced a new high-resolution space-ready camera based on its Emerald™ 67M CMOS image sensor.
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