Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Skunk Works® Advances Sensor-Powered AI Fighter Intercept

08/04/2026 | Lockheed Martin
In a landmark step toward the future of airborne autonomy, Lockheed Martin Skunk Works, the U.S. Air Force Test Pilot School (TPS) and industry partners demonstrated sensor-driven autonomy on a fighter aircraft.

NAMIB EW Payload Completes Rafale Test Flight

07/13/2026 | Globe Newswire
Dassault Aviation and Harmattan AI announced the successful execution of a collaborative in-flight engagement between a Rafale F4 and an unmanned aerial system equipped with the NAMIB payload, a new electronic warfare device jointly developed by both companies.

Boeing Expands German MQ-28 Ghost Bat Industry Team

06/16/2026 | Boeing
Boeing has welcomed two additional industry partners at the ILA Berlin Air Show to expand its German MQ-28 Ghost Bat industry team.

L3Harris Delivering Counter-Drone Systems to US Army

06/15/2026 | L3Harris Technologies
L3Harris Technologies has been selected by the U.S. Army to deliver VAMPIRE™ counter-unmanned systems (c-UxS) to support urgent defense against hostile drones.

Lockheed Martin Wins Navy Contract for PAC-3 MSE Aegis Integration

04/23/2026 | Lockheed Martin
The U.S. government announced a contract with Lockheed Martin for the development, integration and testing of PAC-3® Missile Segment Enhancement (MSE) into the Aegis Combat System.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in