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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Nordson Raises Dividend 15%, Extending 63-Year Growth Streak

08/27/2026 | BUSINESS WIRE
Nordson Corporation announced that its Board of Directors has approved a 15% increase in the Company’s quarterly cash dividend to $0.94 per common share from $0.82.

Nordson Launches ASYMTEK Vantage XL for Panel-Level Packaging

08/25/2026 | BUSINESS WIRE
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.

Nordson Test & Inspection Opens State-of-the-Art  Center of Excellence

08/21/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in test, inspection and metrology solutions for semiconductor and SMT markets, has announced the opening of a brand-new, purpose-built Center of Excellence in Phoenix, Arizona.

Nordson Reports Record Q3 FY2026, Raises Full-Year Guidance

08/20/2026 | BUSINESS WIRE
Nordson Corporation reported results for the fiscal third quarter ended July 31, 2026. Sales were a quarterly record of $818 million, an increase of 10% compared to the prior year’s third quarter sales of $742 million.

Nordson Announces Leadership Transition in Investor Relations

07/30/2026 | BUSINESS WIRE
Nordson Corporation announced a leadership transition within its Investor Relations organization. Matthew Matejka has assumed responsibility for Investor Relations, succeeding Lara Mahoney, who has been appointed to a new role.
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