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SEMI Europe Outlines Six Key Recommendations to Strengthen Chips Act 2.0

04/28/2026 | SEMI
SEMI Europe announced the publication of its Position Paper on the Chips Act 2.0, presenting a set of strategic recommendations aimed at reinforcing and future-proofing Europe’s semiconductor policy framework.

MacDermid Alpha to Debut Zero-PFAS Die Attach Paste ATROX CD 560-1 at SEMICON Southeast Asia 2026

04/27/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will debut ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, May 5–7, in Kuala Lumpur, Booth 2423.

Indium Corporation Joins India’s IDSPS Industry Consortium Partnership

04/24/2026 | Indium Corporation
Indium Corporation announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting R&D, workforce development, and global supply-chain growth.

Infineon Technology Demonstrates Proven Reliability in Space on Artemis II Mission

04/21/2026 | Infineon
NASA's Artemis II mission has successfully returned to Earth after ten days in space, having approached the Moon and reached the farthest distance from our planet ever achieved by crewed spaceflight.

Bosch Executive Erik Rein Elected New President of ESIA

04/21/2026 | ESIA
On 20 April 2026, the General Assembly of the European Semiconductor Industry Association (ESIA) gathered to elect Erik Rein, Executive Vice President and Board Member Mobility Electronics responsible for semiconductor business at Bosch, as the organisation’s new President.
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