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Single Pair Ethernet (SPE): A Valuable Option for Modern Designs

04/20/2026 | Marcy LaRont, I-Connect007
When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.

Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging

04/20/2026 | Marcy LaRont, I-Connect007
The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.

Global AI Optical Transceiver Market to Reach US$26 Billion in 2026

04/20/2026 | TrendForce
TrendForce’s latest research indicates that the global market for AI-focused optical transceivers has entered a phase of rapid growth, with market size projected to expand from US$16.5 billion in 2025 to $26 billion in 2026, representing over 57% YoY growth.

From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026

04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007
Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.

HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots

04/15/2026 | PRNewswire
HYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
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