The Marketing Minute: If Your Marketing Budget Gets Cut in Half, Then What?
Punching Out: How Are the Big Boys in Electronics Doing?
It’s Only Common Sense: Complexity Is the Enemy of Profit
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
April 16, 2026 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
In a featured article, “Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction,” Kuldip Johal of MKS’ Atotech explores one of the most critical reliability points in next-generation designs. As requirements for higher bandwidth, lower latency, and increased compute density accelerate, advanced packaging technologies are evolving rapidly. This piece examines how innovations at the microvia level are influencing performance and long-term reliability, underscoring the foundational role of interconnect integrity in AI-driven systems.
Another feature, “Single Pair Ethernet (SPE): A Valuable Option for Modern Designs,” highlights a promising solution for reducing system complexity and cost. In this interview, Simon Seereiner of Weidmuller and Thomas Keller of Rosenberger discuss the growing adoption of SPE as a streamlined, high-performance networking approach. As electronics systems become more compact and interconnected, SPE offers a scalable Ethernet pathway designed to meet the demands of modern industrial and embedded applications.
Expanding the discussion further, “Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging,” by Marcy LaRont, draws from the Global Electronics Association’s Executive Pulse webinar series. Building on earlier discussions of chip-level innovation, this installment shifts to a systems-level perspective. Featuring insights from Dr. Jung Yoon of IBM, the article explores how AI is reshaping infrastructure, from advanced packaging strategies to data center design and global supply chain considerations, highlighting the interconnected nature of today’s electronics ecosystem.
Don’t miss the upcoming issue of Advanced Electronics Packaging Digest for timely insight into the most current technologies and trends shaping the future of electronic systems. Subscribe here to get the next issue delivered to your inbox on April 20, 2026. Find us on Substack for another way to read.
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
MacDermid Alpha to Address Silver Price Volatility Solutions at ECTC 2026
05/15/2026 | MacDermid AlphaAs volatile silver prices continue to place pressure on semiconductor packaging costs and supply chain predictability, MacDermid Alpha Electronics Solutions will highlight material strategies that help manufacturers reduce dependence on silver without sacrificing reliability, thermal performance, or manufacturing efficiency.
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.