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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Below the Surface: From Nanometers to 10-Gauge—It’s More Than Just a Wire

06/11/2026 | Chandra Gupta -- Column: Below the Surface
Modern life runs on wires: your cell phone, your car, the satellites orbiting above us, and even the dryer in your laundry room all depend on the simple idea of moving electricity from one place to another. From nanometer-scale traces etched onto a semiconductor chip to a thick 10-gauge copper wire carrying current to heat your clothes, it’s tempting to say, “It’s just a wire.” But that hides the real story.

Powering the Future: When Material Choice Defines RF Performance

06/10/2026 | Brian Buyea -- Column: Powering the Future
In RF and microwave design, deciding on which materials to use determines whether your design merely works or truly performs. Yet, designers too often fall back on material selection that is familiar, available, or “good enough.” However, once you move into higher frequencies, higher power densities, and tighter performance tolerances, “good enough” becomes the very thing that holds your design back. That’s where ceramic substrates become a fundamentally different approach to solving RF challenges.

First Mold Expands University Partnerships to Build Next-Generation Manufacturing Talent Pipeline

06/05/2026 | PRNewswire
First Mold announced a long-term partnership with learning institutions, including universities, to enhance the development of skilled talent within their systems.

Nolan’s Notes: Cleaning With Smaller Geometries

06/03/2026 | Nolan Johnson -- Column: Nolan's Notes
Cleaning is an under-appreciated, possibly under-considered step in the PCB assembly process. Smaller geometries, combined with increasingly larger bottom-terminated packages for complex components, using ever-smaller pitch sizes, mean that cleaning solutions must drive deeper and rinse out more easily than ever before, and must extract all flux residue and other contaminants.

Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing

05/27/2026 | Carmichael Gugliotti, Director, MacDermid Alpha Electronics Solutions
The increasing power and complexity of electronics systems are intensifying the demands on printed circuit boards and IC substrates. Applications that include AI infrastructure, high-performance computing, electric vehicles, and next-generation consumer electronics require higher interconnect density and uncompromising reliability. At the same time, PCB fabricators are navigating a manufacturing environment shaped by supply chain volatility, sustainability mandates, and ongoing cost constraints.
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