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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Powering the Future: When Material Choice Defines RF Performance

06/10/2026 | Brian Buyea -- Column: Powering the Future
In RF and microwave design, deciding on which materials to use determines whether your design merely works or truly performs. Yet, designers too often fall back on material selection that is familiar, available, or “good enough.” However, once you move into higher frequencies, higher power densities, and tighter performance tolerances, “good enough” becomes the very thing that holds your design back. That’s where ceramic substrates become a fundamentally different approach to solving RF challenges.

First Mold Expands University Partnerships to Build Next-Generation Manufacturing Talent Pipeline

06/05/2026 | PRNewswire
First Mold announced a long-term partnership with learning institutions, including universities, to enhance the development of skilled talent within their systems.

Nolan’s Notes: Cleaning With Smaller Geometries

06/03/2026 | Nolan Johnson -- Column: Nolan's Notes
Cleaning is an under-appreciated, possibly under-considered step in the PCB assembly process. Smaller geometries, combined with increasingly larger bottom-terminated packages for complex components, using ever-smaller pitch sizes, mean that cleaning solutions must drive deeper and rinse out more easily than ever before, and must extract all flux residue and other contaminants.

Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing

05/27/2026 | Carmichael Gugliotti, Director, MacDermid Alpha Electronics Solutions
The increasing power and complexity of electronics systems are intensifying the demands on printed circuit boards and IC substrates. Applications that include AI infrastructure, high-performance computing, electric vehicles, and next-generation consumer electronics require higher interconnect density and uncompromising reliability. At the same time, PCB fabricators are navigating a manufacturing environment shaped by supply chain volatility, sustainability mandates, and ongoing cost constraints.

Managing DDR4, DDR5, and HBM Supply Challenges

05/26/2026 | Rob Ronan, Retronix Ltd.
The global electronics industry is no stranger to supply chain disruption, yet memory devices, particularly DRAM and NAND flash, sit at the center of a uniquely persistent challenge. The situation is particularly complex because constraints are not isolated; they are occurring simultaneously across both legacy and next-generation memory technologies. From DDR4 shortages driven by supplier exits to DDR5 demand being pulled by AI infrastructure, the market is facing a perfect storm of reduced supply, shifting demand, and aggressive pricing increases. For OEMs, EMS providers, and high-reliability sectors, this is a serious operational challenge.
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