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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

Micro-robot Exoskeletons With Rigid-flex PCBs

09/03/2026 | Anaya Vardya, American Standard Circuits
Building a robot the size of a cockroach requires rethinking every assumption of conventional mechanical and electrical engineering. At the centimeter scale, wire harnesses become unmanageable tangles, rigid chassis structures become disproportionately heavy, and conventional connectors dwarf the components they're meant to join. Rigid-flex PCBs offer a radical solution: Make the circuit board the skeleton.

American Made Advocacy: American PCBs in Big Demand and Short Supply

08/18/2026 | Shane Whiteside -- Column: American Made Advocacy
The PCB industry faces challenges that are only now being recognized by government agencies. Against the backdrop of conflicts in Europe and the Middle East and the ongoing threat of Chinese business and military aggression, the microelectronics industry overall has been upended.

Catching Up With FUJI PCB and FSQuality’s President, Mr. Tianming Liu

08/13/2026 | Dan Beaulieu
I recently interviewed Mr. Tianming Liu, founder of FUJI PCB and FSQuality. His company is built by blending Japanese manufacturing discipline, Chinese execution speed, and an unwavering commitment to quality and customer service. His story is anything but ordinary. From studying and working in Japan for more than a decade to transforming a struggling PCB factory into a profitable operation before launching FUJI PCB, he has shown vision, determination, and continuous innovation.

Smart Textile Integration with Flex PCBs

08/10/2026 | Anaya Vardya, American Standard Circuits
The idea of clothing that monitors your health sounds like science fiction. It is not. Flex PCBs, integrated with conductive yarns and polymer substrates, are turning ordinary fabric into diagnostic platforms and turning your shirt into a medical device. The implications for healthcare, athletics, and workplace safety are profound. The fundamental engineering challenge of wearable electronics has always been the interface between two incompatible worlds: the rigid, planar world of conventional electronics and the soft, stretchy, washable world of textiles. Early smart garments solved this by simply attaching a rigid sensor pod to clothing, which was functional but bulky and uncomfortable. Flex PCBs collapse that boundary.
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