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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Applied Materials Expands Singapore Manufacturing to Support AI Chip Demand

06/11/2026 | Applied Materials
Applied Materials, Inc., the leader in materials engineering solutions for the semiconductor industry, has expanded its manufacturing and R&D operations in Singapore to support the global build-out of AI infrastructure.

Intervala Names George Yeary Vice President of Quality and Customer Experience

06/10/2026 | BUSINESS WIRE
Intervala, a full-service electronics manufacturing services (EMS) provider specializing in complex electronic and electromechanical products, announced key additions and promotions within its leadership team as the company continues to expand its capabilities across industrial technology, data center infrastructure, aerospace and defense, and medical device markets.

Getters, Thermal Management, and High-Reliability Packaging: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

06/10/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.

Below the Surface: From Nanometers to 10-Gauge—It’s More Than Just a Wire

06/11/2026 | Chandra Gupta -- Column: Below the Surface
Modern life runs on wires: your cell phone, your car, the satellites orbiting above us, and even the dryer in your laundry room all depend on the simple idea of moving electricity from one place to another. From nanometer-scale traces etched onto a semiconductor chip to a thick 10-gauge copper wire carrying current to heat your clothes, it’s tempting to say, “It’s just a wire.” But that hides the real story.

Powering the Future: When Material Choice Defines RF Performance

06/10/2026 | Brian Buyea -- Column: Powering the Future
In RF and microwave design, deciding on which materials to use determines whether your design merely works or truly performs. Yet, designers too often fall back on material selection that is familiar, available, or “good enough.” However, once you move into higher frequencies, higher power densities, and tighter performance tolerances, “good enough” becomes the very thing that holds your design back. That’s where ceramic substrates become a fundamentally different approach to solving RF challenges.
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