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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Extropic Signs $75M LOI with U.S. Commerce Department

08/03/2026 | PRNewswire
Extropic, the American company pioneering thermodynamic computing hardware, announced the signing of a letter of intent with the U.S. Department of Commerce for up to $75 million in funding through the CHIPS Research and Development Office (CRDO).

NextNav, Safran Demonstrate 5G PNT Interoperability

07/31/2026 | BUSINESS WIRE
NextNav Inc., a leader in next-generation terrestrial Positioning, Navigation, and Timing (PNT) and 3D geolocation solutions, announced an agreement with Safran Electronics & Defense to integrate and demonstrate interoperability between NextNav's terrestrial 5G Positioning, Navigation, and Timing (PNT) network in Santa Clara County, California, and Safran’s timing and navigation receiver.

SPARK Microsystems Expands European Distribution Network with Alcom Electronics

07/30/2026 | BUSINESS WIRE
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, announced the expansion of its distribution channel in Northwest Europe, welcoming Alcom Electronics to SPARK’s partner network.

Axcelis Announces Successful Purion XEmax Eval Closure at Leading Semiconductor Foundry

07/28/2026 | PRNewswire
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced the successful Purion XEmax™ high energy implanter evaluation closure at a leading foundry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.
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