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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Connect the Dots: Designing for the Future of Manufacturing Reality—Solder Mask and Legend

04/09/2026 | Matt Stevenson -- Column: Connect the Dots
PCBs seem to be getting more complex by the day, so it is important for designers to keep educating themselves about the realities of manufacturing increasingly intricate boards. Last month’s column highlighted design considerations for the strip-etch-strip process and how manufacturers approach that phase of production. Now that we have a functioning board, we must protect the PCB from environmental hazards and document the circuit components. This article will detail the solder mask and legend process and offer best practices for designers to ensure a high-quality result.

Fresh PCB Concepts: Dynamic Solder Mask Compensation in PCBs

03/19/2026 | Team NCAB -- Column: Fresh PCB Concepts
Solder mask has traditionally been treated as a secondary design layer, generated automatically after routing, reviewed briefly, and rarely revisited. In contemporary PCB fabrication, that assumption no longer holds. As conductor geometries shrink and assembly temperatures rise, solder mask has become a significant factor that influences manufacturability, yield, and long-term reliability.

Mycronic Receives Order for a Prexision 8 Evo

02/11/2026 | Mycronic AB
Mycronic AB has received a replacement order for a Prexision 8 Evo from an existing customer in Asia. The order value is in the range of USD 21-24 million. Delivery of the system is planned for the first quarter of 2027.

Siemens Acquires Canopus AI to Bring AI-based Metrology to Semiconductor Manufacturing

02/04/2026 | Siemens
Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/16/2026 | Marcy LaRont, I-Connect007
I was in Chicago this week, where the weather went from sunny and 45° F on the day I arrived to snow and ice by the next morning. As a California/Arizona native, let’s just say I love the look of snow much more than I love driving in it.  Still, I am grateful to have been part of some genuinely fun teambuilding with my colleagues at the Global Electronics Association. My must-reads for this week are a diverse grouping of articles and columns, ranging from printed electronics and additive manufacturing to a comprehensive overview of the European EMS and PCB markets to marketing wisdom and, finally, a book to help you reach your full potential, personally and professionally.
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