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Advanced Electronics Packaging Digest

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BAE Systems, NEC Sign MoU to Strengthen Japan's Active Cyber Defence

06/19/2026 | JCN Newswire
BAE Systems and NEC Corporation have signed a Memorandum of Understanding (MoU) to combine expertise for the implementation of active cyber defence (ACD) solutions for the Japanese Government.

The Test Connection Earns 2026 PCBAA Outstanding Contributor Award

06/18/2026 | The Test Connection Inc.
The Test Connection, Inc., a provider of electronic test and manufacturing solutions, has been recognized by the Printed Circuit Board Association of America (PCBAA) as a recipient of a 2026 Outstanding Contributor Award.

Sony, imec Unveil Backside Connectivity Module for 3D Chip Integration

06/18/2026 | Imec
At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, and Sony Semiconductor Solutions Corporation (Sony) jointly present a novel integration module for highly dense backside interconnects – key components of 3D stacking and backside functionalization technologies.

MicroLED Interconnect Market to Reach $722M by 2033

06/16/2026 | PRNewswire
The global MicroLED interconnect market is entering a period of accelerated growth as artificial intelligence (AI), high-performance computing (HPC), and next-generation data center architectures drive demand for faster, more energy-efficient communication technologies.

SCHMID Group Records More than €26 Million Order Intake since Mid-May

06/16/2026 | Globe Newswire
SCHMID Group announces a strong combined order intake of more than €26 million since mid-May 2026, reflecting multiple customer orders and continued market momentum in advanced PCB and substrate manufacturing technologies for AI infrastructure and next-generation optical module supply chains.
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