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Advanced Electronics Packaging Digest

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Suggested Items

Optimizing the Interconnect with Dr. John T.C. Lee

10/21/2026 | Marcy LaRont, I-Connect007 Magazine
When Dr. John T.C. Lee talks about the evolution of electronics, he keeps coming back to the interconnect. As CEO and President of MKS Inc., he saw growing complexity in the connections between increasingly powerful devices as both a manufacturing challenge and a business opportunity. That thinking helped drive MKS’ acquisition of Atotech in 2022, bringing process chemistry and electroplating together with MKS’ existing strengths in lasers, optics, and precision motion, and giving substance to a strategy the company calls Optimize the Interconnect™. Several years later, AI, advanced packaging, and high-performance computing are putting unprecedented demands on those interconnections

ENPASA Deploys Inmarsat NexusWave for Digital Operations and Crew Communications

10/14/2026 | Inmarsat
Buenos Aires-based shipowner Empresa Naviera Petrolera Atlántica SA (ENPASA) has deployed NexusWave – the fully managed, bonded multi-network connectivity service from Inmarsat Maritime, a Viasat company - across its large tankers Recoleta and Caleta Rosario reinforcing its commitment to operational excellence, digital transformation, and crew welfare.

I-Connect007 Launches Voices of the Industry Podcast Featuring NCAB Group’s Kelly Davidson

10/13/2026 | I-Connect007
I-Connect007 is pleased to announce the release of a new episode of Voices of the Industry, featuring Kelly Davidson, the new president of North American operations for NCAB Group. The PCB industry is navigating significant change, from economic uncertainty and shifting global supply chains to evolving customer demands and increasingly complex technology requirements. Amid these shifts, Davidson stepped into her new leadership role in December of 2025.

TTM Technologies Plans $400M AI Infrastructure Investments in China and Malaysia

10/12/2026 | Globe Newswire
This expansion initiative represents incremental investments to the previously disclosed commitment to invest $1.2 billion through the 2025-2029 timeframe and is buttressed by ongoing discussions with our long-standing customer partners indicating expected demand increases.

Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure

10/09/2026 | BUSINESS WIRE
Lattice Semiconductor, the low power programmable and platform firmware leader, announced a collaboration with Arm to enable secure control, management, and platform adaptability for AI infrastructure.
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