Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Henger Captivates the 2026 JPCA SHOW in Japan with Next‑Generation Plasma Technolog

06/19/2026 | Henger
From June 10–12, 2026, Henger Microelectronics made a powerful appearance at the JPCA SHOW in Tokyo — one of the world’s most influential exhibitions for the electronic circuit and advanced packaging industries.

Murata, Synopsys Team Up on Ansys Simulation Models

06/19/2026 | Murata
Murata Manufacturing Co., Ltd. announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly to Murata's website to access and download the latest high-performance simulation models from Murata.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/19/2026 | Michelle Te, I-Connect007
Why do so many students who begin college intending to pursue STEM careers ultimately change direction? According to research highlighted by Malcolm Gladwell, the answer often has less to do with ability than perseverance. That spirit of continuous learning is reflected in my must-reads for the week, from major industry investments and policy developments to conferences, publications, and tools designed to help engineers improve their craft. Be sure to read the June issues of I-Connect007 Magazine and the Advanced Electronics Packaging Digest, which both published this week. They serve as a reminder that innovation depends not only on technology, but also on the people willing to keep learning and growing throughout their careers.

The Test Connection Earns 2026 PCBAA Outstanding Contributor Award

06/18/2026 | The Test Connection Inc.
The Test Connection, Inc., a provider of electronic test and manufacturing solutions, has been recognized by the Printed Circuit Board Association of America (PCBAA) as a recipient of a 2026 Outstanding Contributor Award.

Scanfil Mysłowice Expands Measurement Capabilities with New 3D Scanning Technology

06/18/2026 | Scanfil
Scanfil Mysłowice has strengthened its measurement capabilities by introducing a new 3D measurement solution, the Creaform HandySCAN 3D scanner.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in