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From June 10–12, 2026, Henger Microelectronics made a powerful appearance at the JPCA SHOW in Tokyo — one of the world’s most influential exhibitions for the electronic circuit and advanced packaging industries. This year’s event spotlighted AI chip substrates, automotive electronics, high‑speed/high‑frequency materials, and advanced packaging, drawing top‑tier global manufacturers and thousands of industry professionals.
At this international stage, Henger showcased a full lineup of flagship plasma solutions, including the AI Plasma Etching & Cleaning System for PCB, Microwave Plasma Cleaning System, and Dual‑Chamber Plasma System for IC Substrates. These systems represent Henger’s latest breakthroughs in precision plasma processing and demonstrate China’s rising strength in high‑end microelectronics equipment.
A Magnet for Global Attention
Henger’s booth quickly became one of the most visited areas of the exhibition. Customers and engineers from Japan, Southeast Asia, Europe, and North America stopped by to explore Henger’s technology and discuss real‑world applications.
Visitors showed strong interest in:
- High‑aspect‑ratio via desmear and etch‑back performance
- AI‑driven plasma uniformity and process stability
- Throughput and production efficiency improvements
- Green, low‑emission plasma processes
- Customizable solutions for HDI, IC substrates, and advanced packaging
Henger’s technical team delivered live demonstrations, one‑on‑one consultations, and in‑depth process discussions, creating a dynamic and engaging atmosphere. Multiple cooperation opportunities were initiated on‑site, reflecting strong global demand for next‑generation plasma solutions.
Showcasing China’s High‑End Equipment on the World Stage
Henger’s presence at JPCA SHOW marks a significant milestone in the company’s global expansion. With independent R&D, patented core technologies, and proven mass‑production performance, Henger is rapidly emerging as a trusted partner for leading PCB and IC substrate manufacturers worldwide.
Looking ahead, Henger will continue to push the boundaries of plasma innovation — delivering smarter, greener, and more efficient solutions to accelerate the global electronics industry’s transition toward higher precision, higher reliability, and sustainable manufacturing. Henger remains committed to building a bridge for international collaboration and advancing the future of microelectronics together with global partners.
