The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Indium Experts to Present on Thermal Interface Materials at IMAPS Microelectronics Symposium
September 24, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
The first presentation, Reflow and Reliability of In-Ag Soldering Thermal Interface Material without Flux for TIM1 and TIM1.5 Applications, will be presented by Senior Research Metallurgist Dr. Jie Geng. The presentation will focus on indium and indium alloys as TIMs for use in thermal management for high-performance computing and AI, specifically examining the influence of the different compositions of In-Ag alloys and reflow conditions on the voiding performance and interfacial intermetallic compounds in soldered joints.
The second presentation, Liquid Metal Paste Dispensing as a Thermal Interface Material for High-Performance Computing Applications, will be presented by Senior Product Development Specialist for Thermal Interface Materials Miloš Lazić. The presentation will explore a new category of liquid metal paste TIMs that combine gallium-based liquid metals with polymeric materials, referred to as polymer-liquid metal hybrids or polymeric liquid metal pastes, which are increasingly critical as electronic devices become smaller, more power-dense, and generate more heat.
The third presentation, Gallium Phase Change Metal Thermal Interface Material, will also be presented by Lazić. This presentation will examine comprehensive testing and results of a novel, patented, gallium-based phase change thermal interface material (PCTIM) that can provide greater thermal conductivity than organic or polymeric PCTIMs.
Lazić is co-chair of the symposium’s thermal materials track. The presentations will take place on Wednesday, October 1, from 9:30 a.m. to 10:55 a.m.
About the Speakers
Lazić is responsible for developing new thermal materials and products, as well as providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products. He holds a bachelor’s degree in electrical engineering and a master’s degree in electronics engineering. Lazić is also certified as an energy efficiency engineer and SMT process engineer, and is fluent in English, Serbian, Croatian, and Bosnian.
Dr. Geng joined Indium Corporation in 2017 and has more than 20 years of experience in materials science research and engineering. He holds a doctorate in metallurgy, a master’s degree in materials science, and a bachelor’s degree in materials science and engineering with notable contributions to the development of Indalloy®292 and Durafuse® HR.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
10/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.