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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Qualcomm, Hugging Face Expand AI Partnership from Device to Cloud

06/29/2026 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced the expansion of its strategic relationship with Hugging Face to advance open, developer-driven artificial intelligence (AI) from devices to cloud infrastructure.

SK Telecom, NVIDIA Build AI Infrastructure to Power Korea’s AI Innovation

06/11/2026 | NVIDIA Newsroom
NVIDIA and SK Telecom announced that SK Telecom plans to build a gigawatt-scale AI Cloud in Korea using the NVIDIA DSX™ platform, with the first AI factory coming online in 2027.

Hon Hai Reports Record May Revenue as AI Server Demand Continues to Accelerate

06/08/2026 | I-Connect007
Hon Hai Precision Industry Co. (Foxconn), the world's largest EMS provider, reported record May revenue of NT$859.4 billion ($27.3 billion), reflecting continued strength in artificial intelligence infrastructure spending and cloud computing markets.

NAVER Expands AI Infrastructure With NVIDIA to Serve Surging Global AI Demand

06/08/2026 | NVIDIA Newsroom
NVIDIA and NAVER announced that NAVER will expand sovereign AI infrastructure, starting at 55 megawatts with plans to move to gigawatt scale using the NVIDIA DSX™ platform to rapidly design, build and scale full-stack, end-to-end AI platforms that can serve enterprises, industries and government.

Bull, Foxconn Partner to Scale AI Infrastructure Manufacturing in Europe

06/01/2026 | Globe Newswire
Bull, a leader in advanced computing and AI, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and leading technology solutions provider, announce a strategic collaboration to manufacture AI and Cloud infrastructure, from Europe to the global market.
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