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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Ucamco Releases Ucam Xpert and Integr8tor Nexus v2025.06
September 2, 2025 | UcamcoEstimated reading time: Less than a minute
Ucamco is thrilled to announce its 2025.06 release, featuring powerful new upgrades to its flagship products; enhancements the team has been refining for over a year. This update delivers such a significant leap in performance, especially for CAM software, that it comes with a bold new name: Ucam Xpert.
Since its introduction earlier this year, Integr8tor Nexus has been met with overwhelming enthusiasm from customers. This new version takes it even further, boosting its capabilities and adding advanced features to streamline workflows like never before.
Ucamco is also offering an early preview of AI Xtract, its upcoming AI-driven job entry assistant. AI Xtract automates text recognition and data extraction from unstructured PDFs. While selected demos are available now, the official release is planned for the autumn 2025 update.
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Indium, Rio Tinto Announce Groundbreaking Milestone in Gallium Extraction Partnership
05/07/2025 | Indium CorporationIndium Corporation and Rio Tinto announced the successful extraction of gallium from feed sourced at Rio Tinto’s Vaudreuil alumina refinery in Saguenay, Quebec, Canada. This achievement highlights the power of collaboration in building a more robust global supply chain for gallium.
Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools
06/14/2024 | SiemensSiemens Digital Industries Software today announced that, in collaboration with Samsung Foundry, they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.
CE3S Announces Webinar: Workplace Health & Safety with PACE Fume Extraction Systems
02/26/2024 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), a leading provider of quality goods and services, is excited to announce an upcoming webinar titled "Workplace Health & Safety with PACE & CE3S: Fume Extraction and the Benefits to your Workforce." The webinar will take place on Thursday, March 28, from 1-2 p.m. EDT.
Dana on Data: Nuke the Netlist
01/18/2024 | Dana Korf -- Column: Dana on DataLate last year, I started thinking about the IPC-D-356 netlist. Why do we generate it? What is its purpose? Why are there so many issues using it? The central theme of my I-Connect007 columns, as well as presentations at PCB technical meetings, has focused on improving data package quality sent from designers to manufacturers. The goal is to transfer the design information to manufacturing and build the PCBs as-is. No semi-automated DFM, stackup generation, CAM editing, or data quality analysis should be needed.
Cadence Signoff Solutions Empower Samsung Foundry’s Breakthrough Success on 5G Networking SoC Design
12/01/2023 | Cadence Design Systems, Inc.Cadence Design Systems, Inc. announced that Samsung Foundry successfully taped out a 5G networking SoC design on the Samsung 5LPE technology using the Cadence® Quantus™ Extraction Solution and Tempus™ Timing Solution.