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IMI Reports US$7.6 Million of Net Income for the First Half of 2025
August 7, 2025 | IMIEstimated reading time: 1 minute
Integrated Micro-Electronics, Inc. (IMI), a global leader in electronics manufacturing services, announced its financial results for the first half of 2025, reporting a net income of US$7.6 million, a significant turnaround from a net loss of US$8.8 million in the same period last year.
Group revenues reached US$497 million, with core revenues contributing US$446 million. Core EBITDA rose to US$32.6 million, representing a 7.3% margin, while core net income grew to US$9.8 million, up from US$3.7 million in 2024.
This positive shift was primarily driven by operational efficiency initiatives and disciplined cost control. The company achieved a US$16.5 million reduction in core fixed overhead and SG&A expenses, with an additional US$11.4 million in cost savings from VIA Optronics. In addition, a 201 basis point improvement in direct material cost ratio was achieved through enhanced supply chain strategies and the adoption of alternative components.
IMI cash reserves increased to US$123 million while reducing total debt to US$271 million.
“Our first-half results reflect strong progress toward our group EBITDA margin target, with our core business already delivering a 7.2% margin,” said Louis Hughes, Chief Executive Officer of IMI. “Despite ongoing market softness, we are collaborating closely with customers to optimize material costs and drive profitability. Our focus on operational efficiency remains firm.”
On July 31, IMI successfully completed the sale of its Czech Republic facility for €10 million. Highvalue customers from the site have been transitioned to IMI’s Bulgaria and Serbia operations, enhancing both service and profitability.
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Alpha and Omega Semiconductor Announces Advanced eFuse that Meets High Reliability Server Application Requirements
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Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.