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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Copper Price Surge Raises Alarms for Electronics
July 15, 2025 | Global Electronics Association Advocacy and Government Relations TeamEstimated reading time: 1 minute

The copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
With limited domestic smelting and refining capacity, other news outlets warn that the short-term impact of the tariff would be higher costs for critical industries, including electronics, which depend on copper for circuit boards, wiring, power systems, and thermal management.
Copper is a foundational material in electronics manufacturing, and nowhere is this more evident than in the production of PCBs. Copper is used at nearly every stage of the board-building process:
- Copper-clad laminates (CCL): Base materials for PCBs consist of dielectric substrates bonded with sheets of copper, which form the conductive layers. A multi-layer PCB may contain several ounces of copper per square foot, a figure that grows in high-density or power-intensive designs.
- Etching and trace formation: The copper layers are chemically etched to form the signal traces that connect components.
- Plated through-holes and vias: Copper is deposited via electroplating to create vertical connections across layers, an especially copper-intensive step.
- Power distribution and ground planes: Copper planes handle power distribution and act as return paths for high-frequency signals, essential for system performance.
- Thermal dissipation: In power electronics and RF devices, copper helps pull heat away from hot components, contributing to system reliability.
The problem is that electronics-grade copper, often in the form of rolled or electrodeposited foil, high-purity cathodes, and specialized plating solutions, is not easily substitutable and has few domestic sources. Nearly all U.S. PCB fabricators and assemblers import copper materials or precursors, frequently from Asia, including countries now affected by the tariff. The electronics industry, particularly advanced manufacturing segments like automotive, aerospace, telecommunications, and defense, could see ripple effects from tariff-driven copper inflation.
The Global Electronics Association is monitoring the situation closely and urging the administration to exempt electronics-grade copper and associated materials from the tariff list. Meanwhile, manufacturers should assess potential cost impacts and explore supply diversification, recycling strategies, and material substitutions.
To learn more, contact Richard Cappetto, richardcappetto@electronics.org.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Trump Copper Tariffs Spark Concern
07/10/2025 | I-Connect007 Editorial TeamPresident Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.
Trouble in Your Tank: Can You Drill the Perfect Hole?
07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?