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How Good Design Enables Sustainable PCBs
August 21, 2025 | Gerry Partida, Summit InterconnectEstimated reading time: 1 minute

Sustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing.
Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products. Let’s explore how adhering to design rules can directly contribute to sustainability and why poor designs can derail these efforts.
The Hidden Cost of Bad Design
Poorly designed PCBs often result in low manufacturing yields, leading to higher scrap rates. For every lot that fails, manufacturers must remake boards, consuming additional materials, energy, and manpower. This cycle not only increases production costs but also amplifies the environmental footprint of each PCB produced.
For example, a design with inadequate annular rings or insufficient conductor or plane clearances may cause defects such as open circuits or shorts. Badly conceived or overly complex HDI stackups can lead to registration issues, delamination, and other non-compliances. These issues often require rework or remakes, both resource-intensive processes. The wasted copper, laminate, chemicals, and labor could have been avoided with a well-structured, IPC-compliant design.
Identifying Design Issues: Tools and Missed Opportunities
The industry has developed advanced tools to identify design issues early in the process, offering the potential to correct problems before manufacturing begins. PCB design tools like Siemens NPI (New Product Introduction) and fabrication tools like Genesis InSight or Integr8tor allow engineers to perform detailed design rule checks (DRCs) and manufacturability analyses. These tools highlight potential risks in the design, such as misaligned drill files, inadequate copper-to-edge clearances, and poorly optimized stackups.
To continue reading this article, which originally appeared in the August 2025 edition of DESIGN007 Magazine, click here.
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PEDC Call for Abstracts Deadline Extended to Aug. 31
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Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
08/20/2025 | Tara Dunn, SMTAThe Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
08/19/2025 | Happy Holden -- Column: Happy’s Tech TalkWith the need for faster speeds, more parts on an assembly, and the trend to make things smaller for portability, the printed circuit design and layout process is both creative and challenging. The process involves “applying the density equation” while considering certain boundary conditions, such as electrical and thermal performance. Unfortunately, many designers don’t realize there is a mathematical process to laying out a printed circuit.