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Nordic Semiconductor Accelerates Edge AI Leadership with Acquisition of Neuton.AI

06/18/2025 | PRNewswire
Nordic Semiconductor, the global leader in ultra-low-power wireless connectivity solutions, today announced its acquisition of the intellectual property and core technology assets of Neuton.AI, a pioneer in fully automated TinyML solutions for edge devices.

Texas Instruments Plans to Invest Over $60 Billion to Manufacture Billions of Foundational Semiconductors in the U.S.

06/18/2025 | PRNewswire
Texas Instruments (TI) announced its plans to invest more than $60 billion across seven U.S. semiconductor fabs, making this the largest investment in foundational semiconductor manufacturing in U.S. history.

Alpha and Omega Semiconductor Introduces 25V MOSFET in DFN3.3x3.3 Source-Down Packaging

06/18/2025 | Alpha and Omega Semiconductor
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its AONK40202 25V MOSFET in state-of-the-art DFN3.3x3.3 Source-Down packaging technology. 

Agileo Automation Announces Future Expansion of A²ECF-SEMI Automation Framework with SEMI EDA Standards

06/17/2025 | Agileo Automation
Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, announced the future expansion of its A²ECF-SEMI automation framework to include SEMI’s EDA (Equipment Data Acquisition) standards suite.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology

06/17/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,
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